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Patent Searching and Data


Title:
METHOD OF PACKING RESIN PLATE AND PACKED PRODUCT
Document Type and Number:
Japanese Patent JP2011168312
Kind Code:
A
Abstract:

To provide a method of packing a resin plate that can prevent the resin plate from absorbing moisture during storage or transportation, and a packed product packed by the packing method.

A stacked article 6 is formed on a lower moisture-proof sheet 4 by stacking a plurality of resin plates 5 one by one on top of the resin plate 5 at the bottom layer, and a moisture-proof sheet 7 is mounted thereon to cover the entire main surface 51 of the resin plate 5 at the top layer. Thereafter, a stretch film 3 laid under the moisture-proof sheet 4 is wrapped around a side surface 61 of the stacked article 6 and the moisture-proof sheets 4 and 7 as a whole to prevent collapsing of the stacked article 6 and the moisture-proof sheets 4 and 7.


Inventors:
OKU HISANORI
SAKAMOTO TAKASHI
Application Number:
JP2010034737A
Publication Date:
September 01, 2011
Filing Date:
February 19, 2010
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
B65D81/24; B65D77/20; B65D81/26; B65D85/00; B65D85/86
Domestic Patent References:
JPH07285670A1995-10-31
JP2005170510A2005-06-30
Attorney, Agent or Firm:
Inaoka cultivation
Mio Kawasaki
Kyoumura Junji