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Title:
METHOD FOR PEELING ADHESIVE FILM
Document Type and Number:
Japanese Patent JP2008045020
Kind Code:
A
Abstract:

To provide a method for peeling an adhesive film, with which a first substrate and a second substrate bonded through an adhesive film are released without applying physical external force to these substrate as much as possible.

In the method for peeling a first substrate and a second substrate bonded by an adhesive film comprising an adhesive polymer and a thermally decomposable metal hydroxide or metal salt hydrate filler dispersed in the adhesive polymer, the peeling method comprises a process for heating the adhesive film to a temperature at which the metal hydroxide or metal salt hydrate is decomposed and dehydrated and promoting peeling.


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JPH1177826TAPE PASTING DEVICE
Inventors:
MASUDA TATSUYA
AMARI SHINGO
Application Number:
JP2006221306A
Publication Date:
February 28, 2008
Filing Date:
August 14, 2006
Export Citation:
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Assignee:
THREE M INNOVATIVE PROPERTIES
International Classes:
C09J5/00; B09B3/00; B09B5/00; C09J7/10; C09J11/04; C09J201/00
Domestic Patent References:
JP2003326640A2003-11-19
JP2002134666A2002-05-10
JP2005272505A2005-10-06
JP2002294192A2002-10-09
JPS6330581A1988-02-09
JPH0649391A1994-02-22
JP2006233003A2006-09-07
JP2002134666A2002-05-10
JP2003326640A2003-11-19
JP2004309551A2004-11-04
JP2005272505A2005-10-06
JP2002294192A2002-10-09
JPS6330581A1988-02-09
JPH0649391A1994-02-22
JP2006233003A2006-09-07
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu



 
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