Title:
METHOD FOR PERFORMING SURFACE TREATMENT OF SUBSTRATE, AND DEVICE
Document Type and Number:
Japanese Patent JP2022020710
Kind Code:
A
Abstract:
To provide a method for achieving an optimum bonding under a temperature as possible as low and with purity of, specifically, a bonded boundary surface, as possible as high, in a technique for bonding both substrates, and provide a device.SOLUTION: A surface treatment is performed by forming amorphous materials 2 and 2' having a thickness of d>0nm onto a substrate surface of at least almost crystalline of substrates (1 and 1').SELECTED DRAWING: Figure 2
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Inventors:
WIMPLINGER MARKUS
Application Number:
JP2021176389A
Publication Date:
February 01, 2022
Filing Date:
October 28, 2021
Export Citation:
Assignee:
EV GROUP E THALLNER GMBH
International Classes:
H01L21/02
Domestic Patent References:
| JP2011054704A | 2011-03-17 | |||
| JP2013046107A | 2013-03-04 | |||
| JP2000012481A | 2000-01-14 | |||
| JP2007301600A | 2007-11-22 |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Taku Morita
Junichi Maekawa
Hideo Nagashima
Ueshima class
Taku Morita
Junichi Maekawa
Hideo Nagashima
Ueshima class
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