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Title:
METHOD FOR PLATING FILM RESISTANT TO SULFURIZATION
Document Type and Number:
Japanese Patent JPS58167793
Kind Code:
A
Abstract:
PURPOSE:To form an inexpensive silver Zn alloy film resistant to sulfurization and having electric characteristics equal to that of a silver contact film on a cathode, by passing DC pulse through an electrolyte with a specific composition containing silver cyanide, Zn(CH)2, NaCN and NaOH. CONSTITUTION:An electrolyte containing 1-30g/l one kind or more AgCH and K Ag(CH)2 as silver cyanide, 50-150g/l Zn(CN)2, 50-350g/l NaCN and 50- 250g/l NaOH is used. By passing DC pulse through the above mentioned electrolyte, a silver.zinc alloy plating film having sulfurization resistance better than that of silver plating is formed on a cathode.

Inventors:
HARA KENJI
KAKO HISAYUKI
Application Number:
JP4895182A
Publication Date:
October 04, 1983
Filing Date:
March 29, 1982
Export Citation:
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Assignee:
YASKAWA DENKI SEISAKUSHO KK
International Classes:
C25D3/64; C25D5/18; (IPC1-7): C25D3/64; C25D5/18
Attorney, Agent or Firm:
Shuichi Hattori



 
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