Title:
METHOD FOR PLATING ON METALLIC BASE MATERIAL
Document Type and Number:
Japanese Patent JP3525618
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a plating method for metallic base material capable of suppressing the occurrence of crack and peel after formation of a plating layer.
SOLUTION: A plating liquid is vigorously injected from a jet nozzle 15 and is cast to the surface of the base material 1 made of aluminum. Voltage is impressed between the nozzle 15 and base material 1 which are electrically connected by the plating liquid, by which the metal ion components in the metallic plating liquid are deposited as a metal matrix and the plating layer is formed as the jet nozzle 15 plays the role of anode and the base material 1 as cathode. The plating liquid is brought into contact with the surface of the base material 1 at the relatively high speed given thereto, by which hydrogen is hardly taken into the formed plating layer. The microscopic porous state which may arise after the formation of the plating layer is thus averted. Then, the plating layer eventually has the residual stress on the compression side.
Inventors:
Takeuchi, Hiromitsu
Okumiya, Masahiro
Tsunekawa, Yoshiki
Okumiya, Masahiro
Tsunekawa, Yoshiki
Application Number:
JP7213796A
Publication Date:
May 10, 2004
Filing Date:
March 27, 1996
Export Citation:
Assignee:
TOYODA GOSEI CO LTD
International Classes:
C23C18/52; C25D3/12; C25D5/02; C25D5/08; C25D15/02; (IPC1-7): C25D5/08
Other References:
社団法人金属表面技術協会編「金属表面技術便覧（改訂新版）」（昭和５２年１２月２５日），日刊工業新聞社発行、第２３６，３１２頁
Attorney, Agent or Firm:
恩田 博宣