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Title:
METHOD FOR PLATING PALLADIUM ALLOY
Document Type and Number:
Japanese Patent JPH02221392
Kind Code:
A
Abstract:

PURPOSE: To rapidly and easily plate a palladium alloy at the time of electroplating a Pd-contg. metallic material by the use of a specified electroplating bath by incorporating an alkylhydroxylamine with the number of carbons specified into the bath.

CONSTITUTION: An electroplating bath having 10-3 mho-cm conductivity and pH 5 is used, when a metallic material contg. at least one kind among silver, copper, Ni, Co, gold, Cr, Mn, Ru, Rh, platinum and Ir in addition to Pd is electroplated. At this time, the electroplating bath contains a Pd complex ion, the complexing agent contains 50C alkylhydroxylamines, and tris(hydroxyethyl) aminomethane is preferably used. Consequently, electroplating is performed as effectively as gold and less expensively, faster and more easily than gold.


Inventors:
JIYOSEFU ANSONII ABIIZU
BUAAJINIA TSUUHEI ETSUKAATO
KIYASARIIN UOROUODEIUKU
Application Number:
JP32747489A
Publication Date:
September 04, 1990
Filing Date:
December 19, 1989
Export Citation:
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Assignee:
AMERICAN TELEPHONE & TELEGRAPH
International Classes:
C25D3/52; C25D3/56; H05K3/24; (IPC1-7): C25D3/56
Attorney, Agent or Firm:
Masao Okabe (2 outside)