To provide a method of polishing a glass substrate which can simply and economically cope with any of different widths of glass substrates by changing the shape of a polished surface of a polishing member without changing the revolving diameter and the inter-shaft distance, and which can produce a glass substrate having an excellent finishing quality.
In a method of polishing a glass substrate, in which a plurality of grinding machines 2 are eccentricity fixed to rotary shafts 1 that are revolved while being rotated by a planetary rotating mechanism so that the grinding machines 2 polish a glass substrate while they pass revolving centers, when a glass substrate having a width which is smaller than a width optimum for the rotating diameter and the revolving diameter is polished, a polishing surface width D in an orthogonal direction of a maximum eccentric direction of the grinding machines 2, is polished by a grinding member 3 having an elliptic flat circular shape reduced from a true circle D, and during this process, the relationship between a polishing surface with d in a minor diameter direction of the elliptic flattened circle shape and the width of the glass substrate is set so that the narrower the width of the glass substrate, the more the polishing surface width d in the minor diameter direction is decreased.
TERANISHI YASUO
OMORI TAMIYA
