METHOD FOR POLISHING EDGE OF SEMICONDUCTOR DISC

Title:

METHOD FOR POLISHING EDGE OF SEMICONDUCTOR DISC

Document Type and Number:

Japanese Patent JPH0760624

Kind Code:

A

Abstract:

PURPOSE: To provide a method capable of polishing a ground edge of a semiconductor disc without any defect of the conventional method even in a notch in some cases.

CONSTITUTION: In a method of polishing the edge of a semiconductor disc 1, even in a notch 5 of the semiconductor disc 1 in some cases, a compressive cloth piece mixed with diamond is pressed as a working surface of a burnishing tool to the edge 3 of the semiconductor disc 1 with designated force and the rotary motion of the semiconductor disc 1 and/or the working surface 4 is executed.

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Inventors:

ANTON FUUBAA
YOASHIMU YUNGE

Application Number:

JP18900994A

Publication Date:

March 07, 1995

Filing Date:

July 20, 1994

Export Citation:

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Assignee:

WACKER CHEMITRONIC

International Classes:

B24B9/06; H01L21/304; B24B9/00; H01L21/306; (IPC1-7): B24B9/00; H01L21/304

Domestic Patent References:

JPS57184662A

1982-11-13

Attorney, Agent or Firm:

Tadashi Hagino (3 outside)

Next Patent: DEBURRING SYSTEM