Title:
METHOD FOR POLISHING WAFER
Document Type and Number:
Japanese Patent JP3820432
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide a method for polishing a wafer capable of conducting copy polishing with an uniform machining allowance.
SOLUTION: In a method for copy-polishing a wafer 10 which can conduct polishing so as to have an uniform machining allowance with its shape maintained, by a template assembly interposed with backing material in a donut-shaped hole of blank material 13 affixed to a rotating machining plate 4, the wafer 10 is supported and polished by the template assembly which is formed with a sheet-shaped elastic body made of silicon gum sponge of roughly 1 to 2 mm thickness and the backing material over it. The sheet-shaped elastic body is not directly used as backing material but interposed between the machining plate 4 and the backing material with known material used as backing material.
Inventors:
Ueno, Junichi
Application Number:
10-116003
Publication Date:
June 30, 2006
Filing Date:
April 10, 1998
Export Citation:
Assignee:
SHIN ETSU HANDOTAI CO LTD
International Classes:
B24B37/04; H01L21/304; B24B37/04; H01L21/02; (IPC1-7): B24B37/04; H01L21/304