PURPOSE: To make it possible to confirm a plurality of data by means of a vibration detector by detecting either of detecting only the presence of a mechanical contact between an object and a carrier or detecting the timing of melting or detecting both of the presence of the contact and the timing of melting.
CONSTITUTION: The electronic component 7 on a PC-board 1 of the method and device for laser soldering of this component is placed on the contact face 3 of the PC-board 1 by the device having a vibration transducer 53 to be brought into mechanical contact with the component 7 while the component is held toward the PC-board 1. Lasers 205 and 207 heat the solder existing on the contact face and the vibrations generated by the lasers in the solder are transmitted to the vibration transducer 53. The vibration transducer 53 detects the melting of the solder from the mechanical contact between the target and the carrier and/or the relatively strong decrease in the vibration amplitude during melting of the solder.
NIKORAASU YOHANESU ANTONIUSU F
ANTONIUSU KORUNERISU MARIA JII
BUETSUSERU YORISU BUETSUSERING
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