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Patent Searching and Data


Title:
METHOD OF POSITIONING WAFER POLISHING PLATE
Document Type and Number:
Japanese Patent JPH06260458
Kind Code:
A
Abstract:

PURPOSE: To enable a plate to be positioned without fail while avoiding such troubles as the wafer pollution and the plate manufacturing cost up.

CONSTITUTION: The periphery of the plate 4 is irradiated with the parallel beams C making an angle of about 30° with the tangent A of the plate 4 from a light source 10 so as to measure the reflected rays B in the radial direction perpendicular to the tangent A using a photosensor 11. When an positioning trench traverses the front part photosensor 11, the shadow of the parallel beams C being obliquely irradiated from the light source 11 is to be cast on the positioning trench so as to reduce the incident light quantity of the photosensor 11 thereby enabling the passage of the positioning trench to be detected.


Inventors:
NAKAZAWA HIRONOBU
Application Number:
JP4369393A
Publication Date:
September 16, 1994
Filing Date:
March 04, 1993
Export Citation:
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Assignee:
TOSHIBA CERAMICS CO
International Classes:
B24B37/00; H01L21/304; (IPC1-7): H01L21/304; B24B37/04
Attorney, Agent or Firm:
Suyama Saichi