Title:
METHOD FOR POURING RESIN BY FLIP CHIP AND METALLIC MOLD FOR POURING RESIN
Document Type and Number:
Japanese Patent JP2000036507
Kind Code:
A
Abstract:
To improve the productivity of a flip chip by quickly pouring resin into a clearance between an electronic part and a substrate in the flip chip.
The inside part of the cavity of a resin injecting mold constituted of a fixed type 5 and a movable type 6 is vacuumed from a bottom face member 14 provided at the bottom face of the cavity, so that a separate type film 12 can be led to the cavity, and a hole part for resin passage is formed at the separate type film 12 by a protrusion 20 provided at a gate 18 communicated and connected with the cavity. At the same time, resin 22 (melting resin materials) is injected from the gate 18 through the hole part 21 into a clearance 4 between an electronic part 2 and a substrate 3 in the cavity.
Inventors:
MAEDA KEIJI
Application Number:
JP21961198A
Publication Date:
February 02, 2000
Filing Date:
July 17, 1998
Export Citation:
Assignee:
TOWA CORP
International Classes:
B26F1/16; B23K26/382; B26F1/31; B29C33/68; B29C45/02; B29C45/14; B29C45/34; H01L21/56; H01L21/60; B29L31/34; (IPC1-7): H01L21/56; B23K26/00; B26F1/16; B26F1/31; B29C33/68; B29C45/02; B29C45/14; B29C45/34; H01L21/60