Title:
自己組織化銅球の調製方法
Document Type and Number:
Japanese Patent JP7197685
Kind Code:
B2
Abstract:
A self-assembly copper ball, conductive ink as well as a preparation method and application of the self-assembly copper ball. The self-assembly copper ball comprises a composite copper ball and a polymer coated on the surface of the composite copper ball, wherein the composite copper ball comprises a copper particle and an oxidation product of a reducing agent adsorbed on the surface of the copper particle.
Inventors:
Lee Go
Hu Xinyan
Ho-Li Zhu
Zhao Tao
Son Rong
Hu Xinyan
Ho-Li Zhu
Zhao Tao
Son Rong
Application Number:
JP2021510823A
Publication Date:
December 27, 2022
Filing Date:
December 29, 2018
Export Citation:
Assignee:
SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY
International Classes:
B22F9/24; B22F1/00; B22F1/065; B22F1/07; B22F1/10
Domestic Patent References:
| JP2016011448A |
Foreign References:
| WO2009014392A2 |
Attorney, Agent or Firm:
Patent Attorney Corporation Eiko Office