To provide a method for preparing a resin pattern having a sufficient thickness more conveniently.

This method for preparing a thick-film resin pattern includes a stage for forming patterned through-holes to a heat-resistant film to form a printing mask and a stage for filling a resin consisting of paint or ink in the through-holes of the mask and curing the resin. Preferably, patterned through-holes are provided to form a printing mask, a supporting film is stuck on one side of the mask, a resin consisting of paint or ink is filled in the through-holes from the exposed side of the mask, the resin is cured, then an adhesive layer is formed on the exposed side of the cured resin, the whole or a part of the mask is removed, as required, and the cured resin is adhered to an adhered through the adhesive layer.