Title:
METHOD FOR PRESS-DICING BASE PLATE, AND APPARATUS USED THEREFOR
Document Type and Number:
Japanese Patent JP2001308035
Kind Code:
A
Abstract:
To provide a method for instantaneously dicing a device wafer and an apparatus used therefor.
A method for press dicing a base plate comprises the steps of simultaneously press blanking device wafers (w) on a work table 4 for chucking at individual chips by using a die 3, having a lattice-like blanking blades. A method of press blanking the device wafers comprises the steps of aligning a street of the wafers on the work table for chucking with a street of the lattice-like blanking blades of the die, installed in parallel with the device wafer surface separately above the wafers, then dropping the die, and simultaneously press blanking the wafers at individual chips by the blades.
Inventors:
TOKUGAWA YOSHITADA
SEKIDA SABURO
KIDA HIROAKI
KUBO TOMIO
SEKIDA SABURO
KIDA HIROAKI
KUBO TOMIO
Application Number:
JP2000117443A
Publication Date:
November 02, 2001
Filing Date:
April 19, 2000
Export Citation:
Assignee:
OKAMOTO MACHINE TOOL WORKS
International Classes:
B26F1/40; B30B1/32; B30B15/02; H01L21/301; (IPC1-7): H01L21/301; B26F1/40; B30B1/32; B30B15/02