Title:
METHOD FOR PRESSING LEAD PLATE
Document Type and Number:
Japanese Patent JP3281865
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide a method for pressing a lead plate in which alteration in the kind of lead plate can be dealt with quickly.
SOLUTION: In the method for producing a lead plate being soldered to pad electrodes on a board mounting a circuit element by pressing a hoop lead plate material 60, the hoop lead plate material 60 corresponding to the width dimension (W) of the lead plate 42 is fed to the position of a press die by an amount corresponding to the length dimension (L) of the lead plate 42 and the hoop lead plate material 60 is pressed through a press die corresponding to the shape at the end part of the lead plate 42 thus producing the lead plate 42.
Inventors:
Toyooka, Shinichi
Nakamura, Takeshi
Nakamura, Takeshi
Application Number:
JP1998000216199
Publication Date:
February 22, 2002
Filing Date:
July 30, 1998
Export Citation:
Assignee:
SANYO ELECTRIC CO LTD
International Classes:
B21D28/00; B21D43/02; H01L23/50; H01M2/10; (IPC1-7): H01L23/50; B21D28/00; B21D43/02
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