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Title:
METHOD FOR PREVENTING ELUTION OF CADMIUM FROM COPPER ALLOY-MADE PIPING EQUIPMENT AND COPPER ALLOY-MADE PIPING EQUIPMENT USING THE SAME, AND COATING FILM FORMING AGENT
Document Type and Number:
Japanese Patent JP2012188758
Kind Code:
A
Abstract:

To provide a method for preventing elution of cadmium from copper alloy-made piping equipment, such as valves and pipe joints, by which the copper-alloy made piping equipment can be provided by re-using the copper alloy containing cadmium, and elution of cadmium from the copper alloy-made piping equipment can be inhibited; and to provide the copper alloy-made piping equipment.

In the method for preventing elution of cadmium from the copper alloy-made piping equipment such as valves and pipe joints, a coating film is formed of an organic substance consisting of unsaturated fatty acid at least on a liquid-contact part of a copper alloy-made piping equipment in which cadmium is solid-soluted, and zinc on a surface layer of the liquid-contact part of the piping equipment is covered with the coating film, thereby the elution of the cadmium solid-soluted in the zinc is inhibited.


Inventors:
Sugaya, Tetsukazu
Application Number:
JP2012000076230
Publication Date:
October 04, 2012
Filing Date:
March 29, 2012
Export Citation:
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Assignee:
KITZ CORP
International Classes:
C23C26/00; C09D191/00; C23C18/32; C23C18/38; C23C28/00; C22C9/04; C22C18/00
Domestic Patent References:
JP2004156136A2004-06-03
JP2008255483A2008-10-23
JP2004156136A2004-06-03
Attorney, Agent or Firm:
小林 哲男