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Patent Searching and Data


Title:
METHOD OF PROCESSING CONDUCTIVE MATERIAL, METHOD OF FORMING CONDUCTIVE MATERIAL, AND PROCESSING DEVICE OF CONDUCTIVE MATERIAL
Document Type and Number:
Japanese Patent JP2009080415
Kind Code:
A
Abstract:

To suppress a defect such as bleeding or burr at a silver wire edge part of a conductive material by local runaway of developing after developing processing.

A developing stop processing tank 18 is provided between a developing processing tank 16 storing a developer 16A and a fixing tank 20 storing a fixing solution 20A along a carrying direction of a photosensitive web 12. The developing stop processing tank 18 stores a stop solution of pH 5 or less. According to this, the photosensitive web 12 leaving the processing tank 16 is carried to the developing stop processing tank 18 and subjected to developing stop processing therein. Therefore, the developer 16A accompanied by the photosensitive web 12 never contacts with the fixing solution 20A, and a defect such as bleeding or burr at the silver line edge part of the conductive material by local runaway of developing can be suppressed.


Inventors:
Hyodo, Tomoyoshi
Tanaka, Katsuhiko
Application Number:
JP2007000251127
Publication Date:
April 16, 2009
Filing Date:
September 27, 2007
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
G03D3/00; G03C5/26; G03D3/08; G03D15/00
Attorney, Agent or Firm:
中島 淳
加藤 和詳
西元 勝一
福田 浩志