METHOD FOR PROCESSING ELECTRONIC PART - SEKISUI CHEMICAL CO LTD

Title:

METHOD FOR PROCESSING ELECTRONIC PART

Document Type and Number:

Japanese Patent JP2007238802

Kind Code:

A

Abstract:

To provide a method for processing an electronic part with an adhesive tape, by which the adhesive tape can be peeled without leaving an adhesive or the like.

This method for processing the electronic part, having a process for adhering an adhesive tape to the electronic part, a process for processing the adhesive tape-adhered electronic part, and a process for irradiating the processed electronic part with light to peel the adhesive tape from the processed electronic part, is characterized in that the adhesive tape has an adhesive layer containing a compound having two or more groups represented by formula (1) (R1, R2are each an alkyl, an aryl, an arylalkyl, H, or a halogen atom).

Inventors:

HAYASHI SATOSHI
FUKUOKA MASATERU
SUMII YUICHI

Application Number:

JP2006064014A

Publication Date:

September 20, 2007

Filing Date:

March 09, 2006

Export Citation:

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Assignee:

SEKISUI CHEMICAL CO LTD

International Classes:

C09J7/02; C09J133/14; C09J201/02; H01L21/683; H01L21/301; H01L21/304

Attorney, Agent or Firm:

Yasuo Yasutomi
Katsutoshi Moroda

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