METHOD FOR PROCESSING SILICON WORK PIECE USING COMPOSITE TYPE OPTICAL TEMPERATURE MEASUREMENT SYSTEM

Japanese Patent JP3676183

B2

PROBLEM TO BE SOLVED: To correctly measure the temperature of a silicon work piece where a process material is present in a wide range including a low temperature by spectrum analyzing ultraviolet beams reflected by the silicon work piece and converting the obtained spectrum data into a temperature value.
SOLUTION: A light source 11 of the light reflection type thermometer radiates ultraviolet rays and visible light beams in a wavelength range of 250-550 nm. The radiated light beams and ultraviolet beam 12 through a polariscope 13. A surface 10A of the silicon work piece 10 is irradiated thereon with the beam with an angle of incidence &phiv (&phiv >45°). The reflecting light beam 12 at the surface 10A is corrected by a polariscope 14, and spectrum analyzed by a spectrum analysis apparatus 15 having an optical grating diffusion element 16 and a silicon photo detector 17, so that spectrum data is obtained. The obtained spectrum data is converted into a temperature value. Information on the temperature value is sent to an electronic circuit or heating element, thereby controlling a temperature. The temperature of the silicon work piece 10 when a process material is applied or the like can be correctly measured accordingly.

Glen Bee Allers
Robert Jay Chichester
Don X Sun
Gordon Albert Thomas

JP2000104530A

July 27, 2005

April 06, 2000

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Lucent Technologies, Inc.

G01K1/14; G01J5/00; G01J5/02; G01J5/10; G01J5/58; G01K7/02; G01K11/00; G01K15/00; H01L21/00; H01L21/324; H01L21/66; H01L21/316; (IPC1-7): G01K11/00; G01J5/00; G01J5/58; H01L21/324; H01L21/66

JP10122973A
JP2000002597A

Masao Okabe
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa

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