To provide a method for processing comprising temporarily fixing an object of processing to a supporting substrate with an adhesive, carrying out a mechanical processing, then dipping the resultant object in a peeling liquid and peeling the object of processing from the supporting substrate.
The method for processing is carried out as follows. The object of processing is temporarily fixed to the supporting substrate with an adhesive for temporary fixing comprising at least one kind of compound (1) selected from N,N-dimethylacrylamide, N-vinylcaprolactam, acryloylmorpholine, 2- hydroxyethyl(meth)acrylate, 2-hydroxypropyl(meth)acrylate, glycerol(meth) acrylate and a polyalkylene oxide mono(meth)acrylate represented by structural formula (I) (wherein, R1, R2 and R3 are each an H or a CH3; and n is an integer of 4-20) and a radical polymerization initiator (2). The prescribed mechanical processing is carried out and the object of processing is then dipped in the aqueous peeling liquid and irradiated with ultraviolet rays at ≤280 nm wavelength.
SAWAMOTO TAKEYUKI
ISHIHARA HISAO
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