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Title:
METHOD FOR PROCESSING WORKPIECE
Document Type and Number:
Japanese Patent JP2017059750
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a plasma processing method capable of suppressing both surface roughness of wiring and surface roughness of a metal mask.SOLUTION: An embodiment includes the steps of: generating plasma of first processing gas containing fluorocarbon gas and/or hydrofluorocarbon gas, in order to etch a diffusion prevention film until copper wiring is exposed; and generating plasma of second processing gas containing carbon, in order to form an organic film on a surface of a workpiece in a state where the diffusion prevention film is etched.SELECTED DRAWING: Figure 1

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Inventors:
KATO KAZUYA
SHINDO TOSHIHIKO
ASAKO RYUICHI
NAGAHATA HISASHI
Application Number:
JP2015185167A
Publication Date:
March 23, 2017
Filing Date:
September 18, 2015
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/3065; H01L21/768; H05H1/46
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka



 
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