Title:
水性樹脂分散体の製造方法
Document Type and Number:
Japanese Patent JP7124316
Kind Code:
B2
Abstract:
The invention is to provide a method for producing an aqueous resin dispersion capable of forming a coating film superior in adhesion to a polypropylene base material, and water resistance. Specifically, the invention provides a method for producing an aqueous resin dispersion, including a step of mixing and polymerizing a polyolefin dispersion (A), a radically polymerizable monomer (B), and a surfactant for emulsion polymerization (C), wherein the amount of the radically polymerizable monomer (B) mixed is 0.5 to 2 times the solid component of the polyolefin dispersion (A) in terms of parts by mass, and the amount of the solid component of the surfactant for emulsion polymerization (C) mixed is 0 to 3 parts by mass with respect to 100 parts by mass of the radically polymerizable monomer (B).
Inventors:
Akira Harada
Satsusuke Haraguchi
Motomi Tanaka
Satsusuke Haraguchi
Motomi Tanaka
Application Number:
JP2017533644A
Publication Date:
August 24, 2022
Filing Date:
June 09, 2017
Export Citation:
Assignee:
Mitsubishi Chemical Corporation
International Classes:
C08F2/44; C08F2/24; C08F255/00
Domestic Patent References:
| JP2011508006A | ||||
| JP2009074047A | ||||
| JP2008163130A | ||||
| JP2005060485A | ||||
| JP2005272621A | ||||
| JP2010001334A | ||||
| JP2000264933A | ||||
| JP9157314A | ||||
| JP57137339A |
Foreign References:
| WO2004101679A1 |
Attorney, Agent or Firm:
Akio Miyazaki
Masaaki Ogata
Masaaki Ogata
Previous Patent: PC tanks and how to build PC tanks
Next Patent: Semiconductor sensors and compound sensors
Next Patent: Semiconductor sensors and compound sensors