To provide a method for producing a base material having a bonding film, which can efficiently produce the base material having the bonding film without depending on a quality of a base material served for bonding to an adherend and a bonding process, wherein the bonding film can be stably bonded to the adherend with high bonding strength and high dimension accuracy; and to provide a method for efficiently bonding the base material to the adherend.

The base material 1 having the bonding film has a base material 2 and the bonding film 3 deposited on the base material 2 and is used for bonding to any adherend. The bonding film 3 has a feature to show adhesion by receiving an energy. The base material 1 is produced by: a base treating step of subjecting a surface of the base material 2 to base treatment according to a physical etching method under a reduced-pressure atmosphere; and a step of forming the bonding film 3 by plasma polymerization on a region of the base material 2, the region thereof being subjected to the base treatment, without bringing the reduced-pressure atmosphere back to the level of the atmospheric pressure after the base treating step.