Title:
METHOD OF PRODUCING DEVICE SUBSTRATE AND LAMINATE
Document Type and Number:
Japanese Patent JP2017139322
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide: a method of producing a device substrate capable of preventing the device substrate from being cracked in peeling the device substrate from a support plate; and a laminate.SOLUTION: A method of producing a device substrate is a method of producing a device substrate from a laminate, the laminate including: a first main surface of the device substrate that has a chamfered portion at a peripheral portion; and a support plate peelably laminated on the first main surface. The method includes a thinning step of thinning the device substrate from a side of a second main surface that faces the first main surface such that the chamfer height of the chamfered portion of the device substrate is less than the thickness of the device substrate.SELECTED DRAWING: Figure 5
Inventors:
ITO YASUNORI
MIYAKOSHI TATSUZO
MIYAKOSHI TATSUZO
Application Number:
JP2016019015A
Publication Date:
August 10, 2017
Filing Date:
February 03, 2016
Export Citation:
Assignee:
ASAHI GLASS CO LTD
International Classes:
H01L21/304; C09J1/00; C09J179/08; C09J183/00; H01L21/02; H01L21/683
Attorney, Agent or Firm:
Kenzo Matsuura