To provide a method for producing electroconductive fine particles, by which the electroconductive fine particles each having a plated layer with a very uniform thickness can be produced without coagulation of the fine particles to be plated and without causing scratches during plating, and a method for producing electroconductive fine particles which are each constituted of a resin fine particle and a tin-silver alloy plated layer formed on the surface of the resin fine particle.
The methods for producing the electroconductive fine particles comprise forming a plated layer on the surface of each fine particle to be plated by using a barrel plating apparatus having a rotatable barrel in a plating tank. In the methods for producing the electroconductive fine particles, fine particles to be plated and dummy particles having particle sizes larger than those of the fine particles to be plated are charged into the barrel, and the plated layer is formed while vibrating the barrel with an amplitude of 0.05 to 3.0 mm and a frequency of 20 to 120 Hz.
OKINAGA NOBUYUKI
MATSUBARA MANABU
| JPH11317416A | 1999-11-16 | |||
| JP2002069663A | 2002-03-08 | |||
| JPH11279800A | 1999-10-12 | |||
| JPH1121692A | 1999-01-26 | |||
| JP2000219993A | 2000-08-08 |
Next Patent: PLATED STEEL SHEET FOR ELECTROMAGNETIC WAVE SHIELD HAVING CORROSION RESISTANCE