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Title:
METHOD FOR PRODUCING ELECTROCONDUCTIVE POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2006206916
Kind Code:
A
Abstract:

To provide a method for producing a polyamide resin composition which can provide a molding having high conductive, impact strength and excellent sliding properties by specifying a composition and the production method, in which a conductive polyamide resin composition is obtained by blending carbon black with a polyamide resin.

The method for producing an electroconductive polyamide resin composition comprises 95-40% by mass of a polyamide resin (A), 5-30% by mass of a conductive carbon black (B), 10-40% by mass of an ethylene/α-olefin copolymer (C) having a reactive functional group which is reactive with a terminal group and/or an amide group of the main chain of the polyamide resin, and 1-10% by mass of a high-density polyethylene resin (D), in which the polyamide resin (A) and the conductive carbon black (B) are previously melted and kneaded, and then the ethylene/α-olefin copolymer (C) and the high-density polyethylene resin (D) are further melted and kneaded.


Inventors:
TANIGUCHI SATOSHI
SAKAI SATOSHI
Application Number:
JP2006084765A
Publication Date:
August 10, 2006
Filing Date:
March 27, 2006
Export Citation:
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Assignee:
TOYO BOSEKI
International Classes:
C08L77/00; C08J3/20; C08K3/04; C08L23/08
Domestic Patent References:
JP2004210828A2004-07-29
JP2003064255A2003-03-05
JP2001329179A2001-11-27
Attorney, Agent or Firm:
Nobuaki Kazehaya
Noriko Asano