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Title:
METHOD FOR PRODUCING ELECTROFORMED PART AND THE ELECTROFORMED PART
Document Type and Number:
Japanese Patent JP2013170300
Kind Code:
A
Abstract:

To provide a method for producing an electroformed part and the electroformed part which prevent formation of voids and cleft-like defects, in regard to one produced by an electroforming method using a transfer die and comprising nickel and a nickel alloy.

An electroformed part 1 without defects inside, such as holes and voids leading to the outside, is produced by forming a second electroforming layer 10 formed by copper electroforming which is used for a filled via on a first electroforming layer 9 formed by nickel electroforming or the like with high hardness and high strength, further by forming a third electroforming layer 12 thereon, by performing post-processing as required, and by applying a nickel plating layer 14 to the entire surface.


Inventors:
KISHI MATSUO
KONISHI MIE
NIWA TAKASHI
Application Number:
JP2012035390A
Publication Date:
September 02, 2013
Filing Date:
February 21, 2012
Export Citation:
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Assignee:
SEIKO INSTR INC
International Classes:
C25D1/00; G04B13/02
Domestic Patent References:
JP2011521098A2011-07-21
JP2004237526A2004-08-26
Foreign References:
US4987799A1991-01-29
WO2011079850A12011-07-07
Attorney, Agent or Firm:
Kentaro Kuhara
Noriaki Uchino
Nobuyuki Kimura