To provide a method for producing heat expansible microcapsules and hollow resin particles with excellent heat resistance.

The invention relates to the method for producing the heat expansible microcapsules comprising polymer (X) wherein the polymer (X) comprises at least one resins selected from a group comprising polyurethane resins, epoxy resins and polyamide resins. The method for producing expansible microcapsules comprising polymer (X) comprises a step preparing an O/W type emulsion (E) by dispersing a mixture (D) comprising a polymer precursor (a) and a solvent (C), in water, a step mixing the emulsion (E) with a polymer precursor (b) or a solution (F) of (b) and then carrying out an interfacial polymerization. The hollow resin particles are obtained by heating the heat expansible microcapsules.