Title:
METHOD FOR PRODUCING INORGANIC BOARD
Document Type and Number:
Japanese Patent JP2017213748
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing an inorganic board capable of preventing the generation of blistering in the surface of a molded body upon primary curing.SOLUTION: Provided is a method for producing an inorganic board comprising: a molding step of obtaining a molded body composed of a core material including a hydraulic inorganic material and a skin material including the hydraulic inorganic material and also covering the core material; and a primary curing step of primarily curing the molded body. In the primary curing step, the primary curing start temperature is set to the one at which saturated water vapor pressure is smaller than the adhesive strength between the core material and the skin material in the molded body obtained by the molding step.SELECTED DRAWING: Figure 1
Inventors:
YAMAMOTO TOMOHISA
SHIROMOTO HIROYUKI
FURUMIYA TAKASHI
SHIROMOTO HIROYUKI
FURUMIYA TAKASHI
Application Number:
JP2016108476A
Publication Date:
December 07, 2017
Filing Date:
May 31, 2016
Export Citation:
Assignee:
KMEW CO LTD
International Classes:
B28B11/24; B28B3/20
Attorney, Agent or Firm:
Keisei Nishikawa
Mizuhiji Katsuhisa
Yoshishige Takeo
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki
Yutaka Kimura
Mizuhiji Katsuhisa
Yoshishige Takeo
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki
Yutaka Kimura