To provide a method for producing a low reflection laminate having a very low minimum reflectance (%) and little process soil in the plasma treated part and to provide the low reflection laminate.
In the method for producing the low reflection laminate, a substrate is disposed between opposite electrodes in the discharge treatment chamber of a plasma discharge treatment apparatus in which one of the electrodes is a roll electrode A, the other is an electrode B coated with an inorganic material and the side of the electrode with comes in contact with the substrate has been adjusted in such a way that the maximum height of the surface roughness stipulated by JIS B 0601 attains to ≤10 μm, and plasma treatment by discharge is carried out while introducing a gaseous mixture containing a rare gas and an organic fluorine compound, a silicon compound or a titanium compound into the discharge treatment chamber to form a thin film containing fluorine, silicon or titanium on the surface of the substrate.
TAKIYAMA NOBUYUKI
FUKUDA KAZUHIRO
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