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Title:
METHOD FOR PRODUCING METAL WIRE PATTERN, BACKLIGHT SYSTEM, AND LIQUID CRYSTAL DISPLAY USING THEM
Document Type and Number:
Japanese Patent JP2009046742
Kind Code:
A
Abstract:

To provide a method for producing a metal wire pattern where a satisfactory metal film can be securely formed on a supporting substrate having a rugged part with an optional shape in a submicron order; to provide a backlight system; and to provide a liquid crystal display using them.

The method for producing a metal wire pattern includes: an organic material coating stage where the surface 10a of a metal substrate 10 is coated with an organic material; a rugged part forming stage where a rugged part 11 is formed at the organic material by a nano imprint process; a plating stage where a metal wire layer 13 is buried in the recessed part 12 of the rugged part 11 by an electroplating process with the metal substrate 10 as a cathode; an adhesion stage where a supporting substrate 14 is allowed to adhere to the surface 10a of the metal substrate 10; and a removing stage where the metal substrate 10 is removed.


Inventors:
MINATO TAKAO
Application Number:
JP2007215854A
Publication Date:
March 05, 2009
Filing Date:
August 22, 2007
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
C25D1/00; F21S2/00; G02B5/30; G02F1/1335; F21Y103/00
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Suzuki Mitsuyoshi
Yasuhiko Murayama