METHOD OF PRODUCING MICROMINATURE CIRCUIT

Title:

METHOD OF PRODUCING MICROMINATURE CIRCUIT

Document Type and Number:

Japanese Patent JPS57160194

Kind Code:

A

Abstract:

A process for making complex, high density microcircuits in which thick-film dielectric pastes (21) are photolithography patterned into high resolution stencils to produce complementary conductor circuitry patterns, the voids (25, 26) of the developed dielectric stencil are filled with thick-film conductor paste (27, 28) and then the resulting structure is fired in an air or nitrogen atmosphere. Thus the number of separate firing operations is reduced which is important in multilevel hybrid structures.

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Inventors:

JIYON PII KAMINGUSU
JIYANISU DEII MAKOSU
DEBITSUDO II PITSUTOKANEN

Application Number:

JP3925582A

Publication Date:

October 02, 1982

Filing Date:

March 12, 1982

Export Citation:

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Assignee:

HONEYWELL INC

International Classes:

G03F7/00; H05K3/10; H05K3/12; H05K3/46; H05K1/03; H05K1/09; H05K3/00; H05K3/40; (IPC1-7): H05K3/12

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