To obtain a semiconductor sealing resin composition having excellent mold release recovery properties.

An epoxy resin composition as the sealing resin composition is obtained by heating and kneading each component of (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D1) a triglyceride of glycerol with a 24-36C saturated fatty acid, (E) an antioxidant, and (F) an inorganic filler as the essential components, cooling, and then grinding the resulting mixture to form grinds having ≤4 meshes and adding and mixing (D2) a triglyceride of glycerol with a 24-36C saturated fatty acid to the grinds in a compounding amount of [(D1)+(D2)] in the entire resin composition of 0.1-2 wt.% at a ratio of [(D2)] to [(D1)+(D2)] of ≥25 wt.% with a particle size of (D2) of from ≤16 meshes to ≥60 meshes.