To provide a method for producing a polyimide resin layer having an adhesive layer which gives high adhesion to a metal layer and has features, for example, to be able to make a polyimide etching shape excellent.
The method includes the process (I) in which a polyimide acid solution is applied and dried to form a layer to be the polyimide resin layer (X) with a low linear thermal expansion coefficient of 1-30 (10-6/K), the process (II) in which a mixed solution containing the precursor resin (A') of a nonthermoplastic polyimide resin (A) and the precursor resin (B') of a thermoplastic polyimide resin (B) to make A'/(A'+B') be 0.30-0.85 is applied and dried to form a layer to be the adhesive layer (Y) 0.1-3.0 m in thickness, and the process (III) for forming the polyimide resin layer (X) and the adhesive layer (Y) by imidation. After the processes (I) and (II) are performed in optional order, the process (III) is carried out to produce a polyimide resin laminate having the adhesive layer.
MATSUMURA YASUSHI
ENOMOTO YASUSHI
| JP2007265543A | 2007-10-11 | |||
| JP2006190824A | 2006-07-20 | |||
| JP2007214555A | 2007-08-23 | |||
| JP2006199871A | 2006-08-03 | |||
| JP2008007631A | 2008-01-17 | |||
| JP2007265543A | 2007-10-11 |
| WO2007015545A1 | 2007-02-08 | |||
| WO2007015545A1 | 2007-02-08 |
Tomohiro Nakamura
Eiichi Sano
Kazuya Sasaki
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