To obtain a prepreg for printed wiring plates suppressed in resin flow during molding without reducing Tg, heat resistance and processability and provide a lamination plate having high accuracy in thickness.
This method for producing a prepreg is to impregnate a varnish obtained by blending (a) a straight chain high molecular epoxy resin having an epoxy group on the reaction terminal, 100-1000 epoxy equivalent and ≥10000 weight average molecular weight, (b) a lower molecular epoxy resin having 100-1000 epoxy equivalent and ≤5000 weight average molecular weight, (c) a curing agent and (d) a hardening accelerator as essential ingredients, to a glass woven fabric or a glass nonwoven fabric and heat the fabric to be in the B stage. In this case, good characteristics are obtained by blending 1-15 pts.wt. of (a) based on 100 pts.wt. of the total solid in the epoxy resin.
HANAWA AKINORI
SAKAI HIROSHI
| JPH09143247A | 1997-06-03 | |||
| JPS61209234A | 1986-09-17 | |||
| JPH09255802A | 1997-09-30 |