METHOD FOR PRODUCING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

Title:

METHOD FOR PRODUCING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

Document Type and Number:

Japanese Patent JP2002016339

Kind Code:

A

Abstract:

To provide a method for producing a printed wiring board by punching the outline and holes using a die in which bristling of basic material fibers is prevented from being left on the punched face.

Solder resist is applied to the vicinity of punched parts of a printed wiring board in which holes are punched by means of a press.

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Inventors:

YAMADA TAKESHI
AMANO TAKAHIRO
SUMIKAWA MASARU

Application Number:

JP2000198298A

Publication Date:

January 18, 2002

Filing Date:

June 30, 2000

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC IND CO LTD

International Classes:

B21D28/00; H05K1/03; H05K3/00; H05K3/28; (IPC1-7): H05K3/00; B21D28/00; H05K1/03; H05K3/28

Attorney, Agent or Firm:

Fumio Iwahashi (2 others)

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