Title:
METHOD FOR PRODUCING RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND METHOD FOR FINELY GRINDING COLORING AGENT THEREFOR
Document Type and Number:
Japanese Patent JP2005120277
Kind Code:
A
Abstract:
To provide a resin composition for semiconductor sealing, in which crude aggregate of carbon black is finely ground in order to reduce occurrence of electric defect of a semiconductor package caused by crude aggregate of carbon black, scarcely causing electric failure.
A method for finely grinding a coloring agent used for resin composition for semiconductor sealing comprises finely grinding the coloring agent by a grinder. A method for producing a resin composition having resin for semiconductor sealing and the coloring agent comprises a process for finely grinding the coloring agent by the grinder.
Inventors:
BABA SHOSHI
ASHIKARI KOTA
SHIBATA HIROSHI
ASHIKARI KOTA
SHIBATA HIROSHI
Application Number:
JP2003358293A
Publication Date:
May 12, 2005
Filing Date:
October 17, 2003
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C09C3/04; C09C1/48; H01L23/29; H01L23/31; (IPC1-7): C09C3/04; C09C1/48; H01L23/29; H01L23/31