Title:
METHOD OF PRODUCING SEMICONDUCTOR SEALING RESIN COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2015101655
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method of producing a semiconductor sealing resin composition capable of forming a semiconductor sealing material excellent in heat resistance, and a method of producing a semiconductor sealing material.SOLUTION: The method of producing a semiconductor sealing resin composition comprises: a first kneading step of heating, melting and kneading a bismaleimide compound represented by formula (1) and a benzoxazine compound represented by formula (2) to obtain a first kneaded material; a first pulverization step of pulverizing the first kneaded material to obtain a pulverized first kneaded material; a second kneading step of mixing the pulverized first kneaded material with a curing catalyst and an inorganic filler and then heating, melting and kneading the mixture to obtain a second kneaded material; and a second pulverization step of pulverizing the second kneaded material to obtain a resin composition composed of powder.
Inventors:
TAKAHAMA KEIZO
YAMASHITA KATSUSHI
OZAKI YUI
YAMASHITA KATSUSHI
OZAKI YUI
Application Number:
JP2013243708A
Publication Date:
June 04, 2015
Filing Date:
November 26, 2013
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G14/12
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