Title:
半導体ウェーハの製造方法
Document Type and Number:
Japanese Patent JP5601778
Kind Code:
B2
Inventors:
Junichi Ikeno
Provincial governor Yosuke
Hideki Suzuki
Provincial governor Yosuke
Hideki Suzuki
Application Number:
JP2009036033A
Publication Date:
October 08, 2014
Filing Date:
February 19, 2009
Export Citation:
Assignee:
Shin-Etsu Polymer Co., Ltd.
Saitama University, National University Corporation
Saitama University, National University Corporation
International Classes:
B23K26/00; B23K26/064; B23K26/073; B23K26/60; B28D5/00; H01L21/02
Attorney, Agent or Firm:
Eisuke Fujimoto
Kanda Justice
Akishige Miyao
Eisuke Fujimoto
Kanda Justice
Akishige Miyao
Eisuke Fujimoto