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Title:
化学的還元法を用いたコアシェル構造の銀コーティング銅ナノワイヤの製造方法
Document Type and Number:
Japanese Patent JP7361158
Kind Code:
B2
Abstract:
The present invention relates to silver-coated copper nanowires having a core-shell structure using chemical reduction and a method of preparing the same. More particularly, the present invention relates to a method of preparing silver-coated copper nanowires including chemically producing copper nanowires and coating the surface of the copper with silver using a silver-ammonia complex solution and a reducing agent in order to prevent oxidation of the copper nanowires by chemical reduction, and silver-coated copper nanowires having a core-shell structure produced by the method. In addition, production costs can be reduced because copper nanowires can be produced by reusing solutions. The method of preparing silver-coated copper nanowires having a core-shell structure according to the present invention can avoid deterioration in electrical conductivity by preventing oxidation even in the air or at high temperatures, thus being useful for the production of electromagnetic shielding paste or highly conductive paste requiring high electrical conductivity.

Inventors:
Park, Han Oh
Kim, Choi Ha
Kim, Chun Pyo
Yun, Kuku Chin
Application Number:
JP2022083942A
Publication Date:
October 13, 2023
Filing Date:
May 23, 2022
Export Citation:
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Assignee:
BIONEER CORPORATION
International Classes:
B22F1/17; B22F1/00; B22F1/054; B22F1/06; B22F1/145; B22F9/24
Domestic Patent References:
JP60100679A
JP2013513220A
JP11335858A
JP2014118589A
Foreign References:
KR1020150145892A
KR1020110059946A
KR1020070104802A
KR1020150045903A
Other References:
小浦 延幸 他1名,総説 無電解銀めっき,金属表面技術,日本,1985年,36巻 5号,p.182-190
Attorney, Agent or Firm:
Makoto Ono
Kennori Kanayama
Yoshiyuki Tsubokura
Kazuki Shigemori
Kenji Ando
Hidehiko Ichikawa
Yoshie Sakurada
Yosuke Kawasaki
Youichi Iino
Yusuke Ichikawa
Yoshikazu Iwase
Yasufumi Shiroyama