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Title:
METHOD FOR PRODUCING VALUABLE METAL RAW MATERIAL FOR RECYCLING FROM PRINT WIRING SUBSTRATE
Document Type and Number:
Japanese Patent JP2012210598
Kind Code:
A
Abstract:

To provide a method for producing a recycling raw material of valuable metals such as high quality aluminum, gold, silver, copper by separating aluminum base substrate parts from print wiring boards having aluminum base substrates.

In the method for recovering the aluminum base substrates, an impact force of 190 N or more is applied to the print wiring substrates 1 in which electronic circuit is formed on the aluminum base substrates via insulating layers with a hammer, a blade, a chain 8, a wire or others. Thus, the aluminum base substrates can be easily peeled from the insulating layer by applying the impact to the print wiring substrates 1, further the valuable metals such as gold, silver, copper used for the printing wire boards can be separated to be used as the valuable metal raw materials for recycling.


Inventors:
SHIRAI RYOICHI
HORI KUNIYOSHI
HOSAKA HIDEHITO
HAISEI KENJI
Application Number:
JP2011078059A
Publication Date:
November 01, 2012
Filing Date:
March 31, 2011
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO
International Classes:
B09B3/00; B02C13/16; B02C13/18; B02C13/28; B09B5/00; C22B7/00; C22B11/00; C22B21/00
Domestic Patent References:
JPH07246382A1995-09-26
JP2002355661A2002-12-10
JP2000301012A2000-10-31
JP2007029923A2007-02-08
JP2009195901A2009-09-03
JP2003010706A2003-01-14
JP2005524532A2005-08-18
JP2003112077A2003-04-15
JPH05237411A1993-09-17
Attorney, Agent or Firm:
Takeuchi/Ichizawa International Patent Office



 
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