To provide a method for producing a vapor deposition mask which satisfies both high definition and weight saving even when the size thereof is increased.
On one surface of a metal mask provided with a slit, a metal mask with a resin layer, which is provided with a resin layer covering the slit of the metal mask, is prepared. The slit is filled with a resist material, and a through-hole having an opening size smaller than that of the slit is formed in the slit filled with the resist material. An etching resistance layer including a material with etching resistance is formed on the resin layer. By using the resist material and the etching resistance layer as an etching resistance mask, etching is performed on the resin layer from the through-hole side. After the etching is finished, the resist material and the etching resistance layer are cleaned and removed. Thus, the vapor deposition mask is produced by forming a resin mask in which a plurality of rows of openings corresponding to patterns to be vapor deposited and produced are vertically and horizontally arranged.
OBATA KATSUYA
NISHIMURA SUKEYUKI
Yasuo Ishikawa
Yoshinori Ishibashi