Title:
METHOD OF PROTECTION OF ELECTRIC DEVICE AND SOLDERED PARTS
Document Type and Number:
Japanese Patent JPH01201901
Kind Code:
A
Abstract:
PURPOSE: To prevent perfect melting of a solder at a soldering connection part to hold at a specified position by coating a device which is coated with an outer layer of plastic material of high melting point with, firstly, an inner layer of plastic material of lower melting point. CONSTITUTION: A device A is a thermister comprising a baked metal powder core 12, with outer layers 14 and 16 of silver oxide, etc., applied on both flat surfaces of the core 12. Wire leads 18 and 20 are, respectively, soldered to the outer layers 14 and 16 at soldering connection parts 22 and 24. The device A is firstly heated to about 149-163 deg.C, then passed to a fluidized bed of powder- like plastic material, and the plastic material is softened to be welded to it, thus an inner layer 30 is formed. After the device A is welded to the inner layer 30, it is inserted in a cavity of a mold, with an outer layer 32 injection- molded of other plastic material around the device. The plastic material used for the outer layer 32 is of melting temperature range about 360-371 deg.C. Here, the inner layer 30 holds a solder so that the solder is prevented from flowing between wire leads and breaking a soldering connection part.
Inventors:
ADAMANTEIOSU ANTONASU
KENESU CHIYAARUZU DEI
KENESU CHIYAARUZU DEI
Application Number:
JP31096988A
Publication Date:
August 14, 1989
Filing Date:
December 08, 1988
Export Citation:
Assignee:
EMERSON ELECTRIC CO
International Classes:
H01C1/032; H01G2/10; H01G4/224; H01G7/04; H01G13/00; (IPC1-7): H01C1/032; H01G1/02; H01G7/04; H01G13/00
Domestic Patent References:
| JPS5297163A | 1977-08-15 |
Attorney, Agent or Firm:
Akashi Masatake
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