METHOD FOR READING RECOGNITION SYMBOL OF PLANE SUBSTRATE SUCH AS SEMICONDUCTOR WAFER, RECOGNITION SYMBOL READER AND HIGH SPEED WAFER TRANSFER DEVICE

Title:

METHOD FOR READING RECOGNITION SYMBOL OF PLANE SUBSTRATE SUCH AS SEMICONDUCTOR WAFER, RECOGNITION SYMBOL READER AND HIGH SPEED WAFER TRANSFER DEVICE

Document Type and Number:

Japanese Patent JPH07141461

Kind Code:

A

Abstract:

PURPOSE: To clearly read the recognition symbols imparted to the smooth plane of a semiconductor wafer.

CONSTITUTION: The uneven cross-sectional shape recognition symbol 4 imparted on the smooth plane 3 of a semiconductor wafer 1 is irradiated with radiating light L from the oblique upper light source 10, a CCD camera 20 is arranged so that the light receiving axis may be deviated from the direction of the regular reflection light La in the plane 3 and large quantity reflection light Lb reflected by the uneven cross-sectional shape recognition symbol 4 is received. Thus, an intensive contrast can be imparted between the recognition symbol and the peripheral part and the recognition symbol can be surely read. Therefore, the high speed automation of the image processing and the manufacturing device become possible.

Inventors:

MIYAGAWA YUICHI

Application Number:

JP28708493A

Publication Date:

June 02, 1995

Filing Date:

November 16, 1993

Export Citation:

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Assignee:

SONY CORP

International Classes:

G06K7/10; G11B23/30; H01L21/02; H01L21/68; G06K9/20; (IPC1-7): G06K7/10; G06K9/20; G11B23/30; H01L21/02; H01L21/68

Attorney, Agent or Firm:

Mitsuo Takahashi

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