Title:
METHOD FOR RECLAMATION OF PACKAGING FILM
Document Type and Number:
Japanese Patent JP2001123004
Kind Code:
A
Abstract:
To provide a method for dissolving and/or extracting an additive such as an adhesive or a coating agent from the resin substrate of a packaging film and reclaiming both the substrate and the dissolved/extracted materials simultaneously at a low cost and in an industrially returnable (repeatedly utilizable) way.
A resin substrate coated with an additive or containing an additive is cut to an appropriate size. It is then treated under agitation with an industrial solvent selected from the group consisting of distillates from a crude oil, i.e., a benzine fraction, a kerosene fraction and a light oil fraction at 65-85°C to remove the additive by dissolving and/or extracting it from the surface of or from the inside of the substrate.
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Inventors:
OGAWA KOICHI
KATAOKA MASAKI
KATAOKA KENJI
KATAOKA MASAKI
KATAOKA KENJI
Application Number:
JP30189099A
Publication Date:
May 08, 2001
Filing Date:
October 25, 1999
Export Citation:
Assignee:
OGAWA KOICHI
International Classes:
C08J11/00; C09D9/00; (IPC1-7): C08J11/00
Attorney, Agent or Firm:
Kiyoshi Minoura