Title:
METHOD FOR RECOGNIZING BUNDLED MATERIAL, METHOD FOR DETERMINING WORK POSITION OF BUNDLED MATERIAL, METHOD FOR CONTROLLING ROBOT, DEVICE FOR DETERMINING WORK POSITION OF BUNDLED MATERIAL, AND SYSTEM FOR PERFORMING BUNDLED MATERIAL
Document Type and Number:
Japanese Patent JP2021089670
Kind Code:
A
Abstract:
To provide a method for recognizing a bundled material, in which the bundled material consisting of a plurality of linear materials can be recognized as a lump; a method for determining a work position of the bundled material; a method for controlling a robot; a device for determining a work position of the bundled material for determining the work position of the bundle material; and a system for performing the bundled material in which work on the bundled material is performed.SOLUTION: A method for recognizing a bundled material includes: an imaging step of imaging the bundle material with an imaging device; a recognition step of recognizing a plurality of linear materials as a lump on the imaged image; and a three-dimensional coordinate calculation step of calculating a three-dimensional coordinate of at least one point included in the recognized lump.SELECTED DRAWING: Figure 1
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Inventors:
KITAI MOTOYOSHI
Application Number:
JP2019220577A
Publication Date:
June 10, 2021
Filing Date:
December 05, 2019
Export Citation:
Assignee:
KURASHIKI BOSEKI KK
International Classes:
G06T7/70; B25J13/08; G01B11/00
Attorney, Agent or Firm:
Fukami patent office