Title:
METHOD FOR RECOGNIZING CHIP
Document Type and Number:
Japanese Patent JP2003296733
Kind Code:
A
Abstract:
To improve the efficiency of a chip mounting operation and to facilitate the yield improvement of a product by omitting inspection after finishing chip mounting.
In mounting many chips 5 on a wiring substrate 1, the presence/ absence and posture of a chip 5 are recognized in real time with difference image processing between before processing and after processing each time the chip 5 is mounted.
Inventors:
KAWADA HIROHIKO
Application Number:
JP2002094896A
Publication Date:
October 17, 2003
Filing Date:
March 29, 2002
Export Citation:
Assignee:
HOKUYO AUTOMATIC CO
International Classes:
H01L21/50; G06T7/00; G06T7/60; (IPC1-7): G06T7/00; G06T7/60; H01L21/50
Attorney, Agent or Firm:
Shogo Ehara (5 outside)