Title:
METHOD FOR RECONVERTING EPOXY RESIN COMPOSITION FOR SEALING ELECTRONIC PART INTO RESOURCE
Document Type and Number:
Japanese Patent JPH06321521
Kind Code:
A
Abstract:
PURPOSE: To reconvert an epoxy resin composition for sealing electronic parts to be disposed of into a resource.
CONSTITUTION: A pulverized material of an epoxy resin composition for sealing electronic parts consisting essentially of silica powder, an epoxy resin and a curing agent is heated in a nonoxidizing atmosphere to synthesize silicon carbide having high added value. Thereby, the epoxy resin composition is reconverted into a resource.
Inventors:
ICHI MASATOSHI
Application Number:
JP11331493A
Publication Date:
November 22, 1994
Filing Date:
May 14, 1993
Export Citation:
Assignee:
NEC CORP
International Classes:
C01B31/36; C08J11/16; (IPC1-7): C01B31/36
Attorney, Agent or Firm:
Sugano Naka
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