To provide a method of effectively recovering a Koval(R) alloy of ≤10 ppm in the content of silver and a silver solder component separately from processing scrap of silver solder clad Koval(R).

This method of recovering the Koval(R) and the silver solder component from the silver solder clad kovar includes a pretreating process step of forming the processing scrap of the silver solder clad Koval(R) to small pieces and deforming the small pieces so as to prevent their surfaces from firmly sticking to each other, an electrolytic peeling treating process step of housing the small pieces of the silver solder clad Koval(R) into a conductive and liquid permeable basket, immersing this basket into an aqueous cyanogen compound solution, using the basket as an anode, disposing a cathode on the outside of the basket and removing the silver solder component from the Koval(R) surface and migrating the same to the anode by performing an electrolytic treatment, a finish peeling treating process step of sufficiently removing the silver solder component from the Koval(R) surface by immersing the small pieces of the silver solder clad Koval(R) subjected to the electrolytic treatment into the aqueous cyanogen compound solution containing oxygen or oxidant and a rinsing process step of rinsing the small pieces removed of the silver solder component from the surface of the Koval(R) with water.